Teradek Unveils Addition To Cube Family

Teradek has introduced the Cube 600 series. The new Cube 605 and 655 feature several upgrades, including a dedicated embedded network processor, supporting GigE for higher bitrates, enhanced 802.11ac Wi-Fi for longer range, dual HDMI/HD-SDI inputs, and built in bonding with ShareLink™.

The addition to the Cube line aims to provide the next generation versatile encoding for independent content creators and professionals.

"Teradek Cube has long been referred to as the 'Swiss Army Knife' because of its adaptability and reliability," said Nicol Verheem, CEO of Teradek. "Over the years, Cubes have been deployed into a diverse range of applications, from IP transmission underwater to space exploration. We've packed this new Cube with an arsenal of hardware upgrades and can't wait to see where our customers are going to take this new product."

The new dual processor within the Cube 600 series offers higher data throughput and a better user experience. It also features a dual-input HDMI/3G-SDI interface – instead of having to choose between HDMI and SDI models – making the single unit more versatile for applications. The HDMI port will also ingest 4K resolution video signals and encode up to 1080p30.

For uninterrupted HD broadcast, the new Cube includes Teradek's ShareLink technology, which combines the connectivity of up to four network interfaces bonded into a single bandwidth link. This feature allows users to aggregate sufficient bandwidth for successful live stream no matter where they are.

Like the other Cube models, the Cube 600 series seamlessly integrates with Teradek Core, the latest in cloud-based multi-point routing, DVR and remote device management.

Additional upgrades for the new Cube include: Gigabit Ethernet for camera control and system integration, additional clients for iPad monitoring, 3D LUT color management, SD card recording and archival, and bidirectional IFB communication.

The new Cube 600 series will be on display at IBC, alongside Teradek's other products, at Booth 11.E55.

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(JP)